MediaTek continues the growth that has led it to surpass Qualcomm by becoming the first major supplier of smartphone chips and expands the Dimensity chip family with the new 900 5G. SoC is made with a 6nm production process and can support Wi-Fi6 2×2 MIMO connectivity, 120Hz FHD display, and photo sensors up to 108MP.
Dimensity 900 has an octa-core architecture with two Cortex-A78 2.4GHz cores and six Cortex-A55 2GHz cores. LPDDR5 RAM and UFS 3.1 memory for storage are supported, and the built-in 5G modem provides sub-6GHz support with carrier aggregation and up to 120 MHz bandwidth, as well as Bluetooth 5.2 and GNSS connectivity
The SoC also integrates a MALI-G68 MC4 GPU and a third-generation independent AI Processing Unit that provides greater energy efficiency to maximize battery life. Other Dimensity 900 5G features include the native HDR image signal processor (ISP) with hardware acceleration, capable of supporting up to four cameras and sensors up to 108MP.
HARDWARE SPECIFICATIONS
- Production Process: TSMC at 6nm
- CPU: 64-bit octa-core
- 2x Cortex-A78 @ 2.4GHz
- 6x Cortex-A55 @ 2GHz
- GPU: Arm Mali-G68 MC4
- AI: MediaTek 3rd Generation AI APU
- Memories:
- RAM: 4LPDDR4x, LPDDR5
- Storage: UFS 2.1, UFS 3.1
- Camera: 108MP, 20MP + 20MP
- Video Decoding: 4K 30fps, H.264, H.265 / HEVC, MPEG-1/2/4, VP-9, AV1
- Video Encoding: 4K 30fps H.264, H.265 / HEVC
- Display: Maximum resolution 2520 x 1080 with maximum refresh at 120Hz
- Connectivity: Wi-Fi 6 (a / b / g / n / ac / ax), Bluetooth 5.2
- Modem: SA & NSA Sub-6GHz
Dimensity 900 supports MediaTek’s Hyperengine, the new “gaming engine” that intelligently and simultaneously activates the data connectivity of the two SIM and Wi-Fi, ensuring smooth and larvae-free connection while improving performance in games.
