Apple Inc. has agreed to spend more than $30 billion on semiconductor components from Broadcom Inc. through 2031, expanding a long-term partnership that underscores the iPhone maker’s growing commitment to U.S. manufacturing and supply chain resilience.
The multi-year agreement covers film bulk acoustic resonator (FBAR) filters, radio-frequency chips that enable wireless connectivity across Apple’s ecosystem of devices. The companies said they have been jointly developing the components since at least 2023.
The announcement sent Broadcom shares up more than 4% in trading, while Apple stock was little changed, reflecting investor confidence in Broadcom’s long-term revenue visibility from one of its largest customers.
As part of the agreement, Broadcom will invest $1.5 billion to expand its manufacturing facility in Fort Collins, Colorado, increasing domestic production capacity for advanced wireless components. Apple said the partnership is expected to result in the manufacture of at least 15 billion chips over the life of the contract.
“The cutting-edge components built in Fort Collins are essential to delivering the incredible performance and connectivity our customers expect, and we’re proud to deepen our investments in U.S.-based suppliers that share our commitment to excellence and innovation,” Apple Chief Executive Officer Tim Cook said in a statement.
The deal reinforces Apple’s strategy of localising more of its semiconductor supply chain as geopolitical tensions and government incentives continue to reshape global chip manufacturing. While Apple remains heavily dependent on manufacturing partners across Asia for device assembly, it has steadily increased investments in U.S.-based suppliers and production capabilities.
The agreement also aligns with broader efforts by Washington to expand domestic semiconductor manufacturing through public incentives and private-sector investment. Apple said the partnership will support high-skilled manufacturing jobs while strengthening the resilience of its supply chain.
For Broadcom, the contract provides another significant long-term revenue stream beyond its diversified portfolio of networking, broadband, enterprise software and custom silicon businesses. The company has increasingly positioned itself as a strategic supplier to hyperscalers and major technology firms developing advanced AI infrastructure and next-generation connectivity solutions.
The latest commitment builds on Apple’s wider U.S. investment plans. In August 2025, the company increased its domestic investment pledge to $600 billion over four years, adding $100 billion to an earlier commitment. The spending spans manufacturing, research and development, engineering, silicon design and advanced production capabilities across the United States.
The Broadcom agreement highlights how leading technology companies are continuing to deepen investments in domestic semiconductor production as demand for high-performance chips accelerates across smartphones, artificial intelligence and connected devices. For Apple, securing a reliable supply of critical wireless components is becoming increasingly important as its products incorporate more advanced connectivity technologies and on-device AI capabilities.