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New information is reaching us about the Galaxy Z Flip 3, which Samsung will announce in less than a month.
The design of the Galaxy Z Flip 3 has already been the subject of several leaks: it is now the turn of the first technical specifications of the foldable screen smartphone in a clamshell way to reveal itself.
A Snapdragon 888 chip for performance
These are revealed through a benchmark of the Geekbench platform, which unveils a performance test for a device under the reference SM-F7110U, which we know to be the Z Flip 3.
We learn that the smartphone is equipped with a Snapdragon 888 SoC from Qualcomm, while its predecessor had not had the right to the best chip available on the market when it was released (a Snapdragon 855+ rather than a Snapdragon 865). The version tested here embeds 8 GB of RAM.
The folding smartphone unsurprisingly runs android 11 and gets a score of 1,015 in single-core and 3,161 in multi-core on Geekbench, but Samsung probably still has some optimizations to achieve before the release of the mobile, which will be announced on August 11 at a Galaxy Unpacked conference.
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